Multi-keyed wafer carrier



FIG. 1 is a bottom perspective view of a multi-keyed wafer carrier showing a first embodiment of our new design;

FIG. 2 is an enlarged view of a portion of FIG. 1;

FIG. 3 is a bottom plan view of the first embodiment;

FIG. 4 is an enlarged view of a portion of FIG. 3;

FIG. 5 is a bottom perspective view of a multi-keyed wafer carrier showing a second embodiment of our new design;

FIG. 6 is an enlarged view of a portion of FIG. 5;

FIG. 7 is a bottom plan view of the second embodiment;

FIG. 8 is an enlarged view of a portion of FIG. 7;

FIG. 9 is a bottom perspective view of a multi-keyed wafer carrier showing a third embodiment of our new design;

FIG. 10 is an enlarged view of a portion of FIG. 9;

FIG. 11 is a bottom plan view of the third embodiment;

FIG. 12 is an enlarged view of a portion of FIG. 11;

FIG. 13 is a top perspective view that can correspond to any of the first, second, or third embodiments;

FIG. 14 is a top plan view that can correspond to any of the first, second, or third embodiments; and,

FIG. 15 is a right side view that can correspond to any of the first, second, or third embodiments, the left side, front, and rear views being the same as the right side view.

The dash-dot broken lines shown in the drawings define the area corresponding to the enlarged portion shown in FIGS. 2, 4, 6, 8, 10, and 12 views and form no part of the claimed design. 

CLAIM The ornamental design for a multi-keyed wafer carrier, as shown and described. 